Therefore, when defining a new IC, we need a way to predict thermal shutdown or excessive die temperature based on complex internal functions.įor operation in DC mode, you can often determine the junction temperature using data-sheet parameters such as θ JA (thermal resistance) and θ JC (thermal junction temperature). When a particular IC operates at a high temperature (such as +125☌), does it trigger the thermal-shutdown circuitry or exceed the product's safe operating temperature? Without a definite method of analysis, we cannot offer a reliable answer. 68 (PDF, 2.72MB).Ī similar article appeared in EDN Magazine in January 2010.ĭesigners often need to know the thermal behavior of an IC, especially for the PMICs (power-management ICs) used in automotive applications. Others provide protection against electrostatic discharge (ESD), high temperatures, or over-voltage conditions.This article was also featured in Maxim's Engineering Journal, vol. Some network and communication chips have an integrated charge pump or joint test action group (JTAG) pin. In terms of features, communication chips that are designed for the European marketplace must comply with the Restriction of Hazardous Substances (RoHS) directive from the European Union (EU). Examples include ball-grid array (BGA), chip-scale package (CSP), quad flat package (QFP), small outline package (SOP), and dual in-line package (DIP). Many different IC package types are available. Performance specifications for network and communication chips include data rate, operating current, power dissipation, and temperature junction. ![]() Network and communication chips such as voice-over-IP (VoIP) interfaces, ZigBee coordinators, ZigBee routers, ZigBee end-devices are also available. Others are used as powerline networking devices, protectors, receivers, repeaters, radio frequency identification (RFID) devices, sample rate converters, serializers-deserializers (SerDes), subscriber line interface circuits (SLIC), storage interfaces, transmitters, transceivers, terminators, or universal asynchronous receiver/transmitters (UART). Some products are used as buffers, framers, front-ends, isolators, link layer controllers, media access controllers (MAC), or physical layer controllers (Phy controllers). Network and communication chips differ in terms of device types and applications. The 4G standard is based solely on packet switching, whereas 3G is based on a combination of circuit and packet switching. ![]() Third generation or 3G technologies for network and communication chips include universal mobile telecommunications systems (UMTS), enhanced data rates for global evolution (EDGE), and global system for global communication (GSM). Wireless communication chips are often described as using 3G or 4G technologies. Bluetooth is a registered trademark of the Bluetooth Special Interest Group (SIG), a trade association that establishes Bluetooth standards for manufacturers. Bluetooth ® chips provide wireless connectivity in solution-on-chip (SoC) platforms that power short-range radio communication applications. Wireless technologies for network and communication chips include code division multiple access (CDMA), wide band code division multiple access (WCDMA), wireless fidelity (WiFi) or IEEE 802.11, worldwide interoperability for microwave access (WiMAX) or IEEE 802.16, wireless mesh (Wi-Mesh), and ZigBee or IEEE 802.15.4. Serial technologies for communication chips include RS232, RS422, RS485, serial peripheral interface (SPI), universal serial bus (USB), and USB on-the-go (USB OTG) or USB 2.0. Network and communication chips support many different types of serial and wireless technologies. Network and communication chips that use peripheral component interconnect (PCI), compact PCI (cPCI), and PCI Express (PCIe) are also available. Network and communication chips can also use Ethernet, Fiber Channel, IEEE 1394 or FireWire ® (Apple Computer), Microwire ® (National Instruments), PanelBus, high-speed downlink packet access (HSDPA), inter-integrated circuit (I2)C, infrared data access (IrDA), global positioning system (GPS), general packet radio service (GPRS), low-voltage CMOS (LVCMOS), subscriber identification modules (SIM), small computer systems interface (SCSI), and the VersaModule Eurocard bus (VMEbus).
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